SOLIDWORKS Flow Simulation

SOLIDWORKS Flow Simulation

SOLIDWORKS Flow Simulation focusses on the Computational Flow Dynamics (CFD) of liquids and gases. It provides dynamic feedback on the fluid flow and thermal performance of the designed products.

HVAC Applications Module

The HVAC Applications Module includes the functionalities required for modeling complex heating, ventilation, and cooling systems. It provides additional capabilities for simulation of radiations and pollutants.

Electronics Cooling Module

The Electronics Cooling Module (ECM) is available as an add-on for SOLIDWORKS Flow Simulation and provides additional materials and material models that are specific to circuit board and PCB enclosure analysis. It evaluates thermal properties and cooling requirements for standard components.

FEATURES
AVAILABLE

  • Fluid Flow Simulation
  • Multi-Parameter Optimization
  • Material Database
  • 2D and 3D
  • Heat Conduction in Solids
  • Internal and External
  • Gravity
  • Symmetry
  • Boundary Layer Description
  • Porous Components
  • Flow, Thermal, and Wall Conditions
  • Visualization
  • Communication & Reporting
  • Two-Phase (Fluid + Particles) Flows
  • Results Customization
  • Concurrent Engineering
  • Embedded in SOLIDWORKS
  • Design Comparison Studies
  • Ease of Use/Intuitiveness
  • Post Processing
  • Design Data Reuse
  • Rotation
  • Free Surface
  • Gases, Liquid, and Steam
  • Mixing Flows
  • Non Newtonian Fluids
  • Noise Prediction (Steady State and Transient)
  • Enriched Library for HVAC
  • Thermal Fluid Simulation
  • Thermal Comfort Parameters Simulation
  • Advanced Radiation Simulation
  • Tracer Study
  • Enriched Library for Electronic Cooling
  • Joule Heating Simulation
  • Dedicated Electronic Cooling Simulation
  • Circuit Board Component Simplifications

SOLIDWORKS Flow Simulation

HVAC Applications Module

Electronics Cooling Module

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